Synopsys and TSMC are pushing the boundaries of AI and multi-chip designs, working together to offer advanced EDA and IP solutions on TSMC’s cutting-edge process nodes and 3DFabric technology. As the demands of AI grow, semiconductor technology must evolve to keep up. This collaboration, built on decades of partnership, is paving the way for the future of AI chip designs, expected to feature billions or even trillions of transistors.
Synopsys’ AI-driven EDA suite, powered by Synopsys.ai, is already enhancing productivity and improving silicon performance. Additionally, the two companies have developed back-side routing support on TSMC’s A16 process, improving power distribution and routing efficiency for advanced designs. Synopsys tools, cloud-certified by TSMC, are available to customers for seamless integration with TSMC’s process technologies, providing accurate and efficient cloud-based design solutions.
The collaboration also addresses the complexities of multi-chip design, integrating Synopsys 3DIC Compiler and Ansys RedHawk-SC for comprehensive system analysis, including thermal and timing considerations. With silicon-proven IP on TSMC’s N3E and N5 nodes, Synopsys delivers risk-reduced solutions, including UCIe and HBM3 IP, supporting high-bandwidth, energy-efficient designs for next-gen AI and multi-chip applications.
This partnership marks a significant step forward in enabling the future of AI and semiconductor innovation.
All Comments (0)