On September 23, 2024, Xinchun Technology, a leading high-tech firm based in Wuhan, China, unveiled the NM101—the country’s largest-capacity 3D memory chip to date. This groundbreaking chip, designed and developed entirely in-house, marks a major milestone in China’s journey toward self-reliance in cutting-edge memory solutions.
The NM101 chip features an advanced 3D stacking design and utilizes resistive switching technology, integrating billions of non-volatile memory cells onto a single chip. With a massive 64Gb capacity and read/write speeds 10 times faster than existing alternatives, the chip’s lifespan has also increased fivefold. This makes it an ideal choice for high-demand applications like virtualization and databases.
Xinchun Technology’s General Manager, Dr. Liu Jun, expressed pride in the innovation, highlighting its importance in powering domestic data centers and cloud computing platforms. By reducing dependency on foreign technologies, the NM101 is poised to drive digital infrastructure upgrades and enhance China’s semiconductor ecosystem.
As Xinchun continues to push forward in memory innovation, the NM101 is only the beginning of its ambitious plans to expand and transform the industry.
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