At SEMICON Taiwan, TSMC's VP of Advanced Packaging, Dr. Jun He, spotlighted 3D IC as the key to integrating AI chips’ memory and logic components, predicting the global semiconductor market will surpass $1 trillion by 2030, with AI and HPC driving 40% of that growth.
TSMC’s innovative approach, which replaces traditional SoC+HBM designs with chiplet-based architectures, can cut production costs by up to 76%. Despite a 2% cost hike in new architectures, overall Total Cost of Ownership (TCO) improves by 22%.
However, challenges remain, especially in scaling 3D IC capacity, with complexity increasing threefold for larger chips. TSMC is tackling these hurdles with automation, process control, and its advanced 3DFabric platform, leveraging AI for precision quality control.
TSMC also introduced its "3D Optical Engine" strategy, aiming to meet skyrocketing bandwidth demands in data centers. By integrating silicon photonics, its Compact Universal Photonic Engine (COUPE) will revolutionize data transmission. The first generation boasts speeds of 1.6 Tbps, with future iterations targeting 12.8 Tbps.
While TSMC’s silicon photonics roadmap is newly public, its patent history reveals early groundwork laid over a decade ago. TSMC is now firmly positioned as a leader in advanced packaging and silicon photonics, crucial for powering the AI-driven future.
All Comments (0)