Intel’s advanced 18A chip manufacturing process has hit a roadblock, following disappointing test results from Broadcom, according to multiple reports. The tests, which involved printing circuits for Broadcom on Intel’s 18A node, did not meet expectations for defects and yield. This setback is a blow to Intel's efforts to revive its contract manufacturing business, which has been pivotal in its turnaround strategy.
Broadcom’s decision comes after it tested silicon wafers made using Intel's latest node, which is designed for producing cutting-edge chips. Despite Intel claiming the process is “healthy and yielding well,” Broadcom has not yet concluded its evaluation. The underperformance could delay high-volume production, further complicating Intel’s plans to achieve financial recovery.
Intel's foundry business lost $7 billion in 2023, and this setback could impact its goal of breaking even by 2027.
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