At the (China International Optoelectronic Exposition), Huagong Zhengyuan, a subsidiary of Huagong Technology, introduced two cutting-edge 1.6T high-end silicon photonic module products. These modules, which leverage Huagong's self-developed 200G single-wave silicon photonics chips, are designed for advanced optical communication systems, including AI computing and data center applications.
One of the main highlights is the incorporation of thin-film lithium niobate modulators and quantum dot laser solutions, which significantly enhance data transmission performance while maintaining low power consumption. The modules boast 8 parallel transmit and receive channels, each capable of delivering high bandwidth suitable for 1.6T Ethernet systems, making them ideal for large-scale AI and cloud computing tasks.
These new products aim to set a new benchmark in optical communication technology by increasing data transmission speeds while maintaining energy efficiency, aligning with the industry's push for more efficient high-bandwidth solutions for AI and telecom sectors.
Huagong's continued innovation in silicon photonics technology places the company at the forefront of next-generation communication technologies.
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