Murata has unveiled a groundbreaking Integrated Package Solution that embeds capacitors directly into the PCB (Printed Circuit Board), eliminating the need for traditional surface-mount capacitors. This new “embedded capacitance” technology frees up valuable PCB surface space while maintaining high efficiency and performance, a solution aimed at enhancing modern electronic systems.
The embedded capacitors are created using a multilayer process, similar to traditional surface-mounted capacitors, but are integrated within the PCB layers. A key feature of this design is the inclusion of through-holes, which connect the top and bottom electrodes of the capacitor. These through-holes allow for vertical power delivery, significantly shortening the power supply distance within the package and reducing power loss.
In addition to capacitors, power devices are also being embedded within PCBs, further advancing compact, high-performance electronic designs. This technology represents a step forward in power efficiency and miniaturization, making it ideal for applications where space and power optimization are crucial, such as in high-performance computing and telecommunications.
Murata's embedded capacitance solution is set to reshape PCB designs, enabling more efficient power distribution and improving overall system reliability and performance.
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