On September 10, 2024, UNISOC and China Unicom jointly announced the launch of the AI+5G+eSIM Industry Collaboration Plan at a themed event in Shenzhen titled "All-Time Connection, Towards a Chip-Driven Future." This initiative aims to harness the power of 5G, artificial intelligence (AI), and eSIM technology to meet the growing demand for always-on AI terminals.
As part of this collaboration, the two companies will leverage their strengths in communication technology and AI to drive the integration of 5G and eSIM for innovative applications. They aim to build a solid ecosystem by supporting partners in the development of products like tablets, laptops, and next-generation devices. This plan marks a significant step in advancing the fusion of AI, 5G, and eSIM in the industry, paving the way for enhanced AI-enabled devices and accelerating digital transformation.
The partnership is seen as a key driver of future advancements, especially as the demand for high-performance AI terminals continues to rise. Both companies will work together to inject new energy into the digital economy and explore smart solutions for the evolving AI-driven landscape.
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