On September 12, 2024, South Korean tech firm AP Solution, led by CEO Choi Ji-hoon, unveiled a breakthrough Anti-Cu Migration plating technology aimed at preventing copper diffusion in glass substrates, a critical issue for high-performance electronics.

AP Solution Develops Advanced Plating Technology to Prevent Copper Diffusion in Glass Substrates-3CGO
An Intel engineer holds a test glass core substrate panel at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)

AP Solution, a joint venture between Acculaser and Daichi Korea, focuses on the transfer of semiconductor process technologies. Their latest innovation addresses the problem of copper diffusion, which can lead to electrical shorts, malfunctions, or even fires in PCBs (printed circuit boards) and glass substrates. This issue commonly arises at the interfaces of via holes, epoxy coatings, ABF buildup layers, and soldering sections of PCBs, compromising device reliability.

The new plating technology is especially relevant for the commercialization of high-performance glass substrates used in advanced applications such as AI. By significantly reducing copper migration, AP Solution’s development promises to enhance the durability and safety of glass substrates, making them more viable for future semiconductor applications.

This advancement could play a crucial role in improving the performance and reliability of AI hardware and other sophisticated electronics, where glass substrates are increasingly being adopted for their potential to support higher speeds and more complex designs.