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Oracle to Deploy Groundbreaking Supercluster with 130,000+ GPUs for Next-Gen AI Computing
Battle of the Flagship Chips: Snapdragon 8 Gen 4 and Dimensity 9400 Set to Redefine Performance
Synopsys Launches Industry-Leading 40G UCIe IP to Accelerate Multi-Chip System Design
Infineon Develops World's First 12-Inch GaN Wafer, Plans Public Unveiling at electronica 2024
Toshiba Showcases SiC Innovation and Expands IGBT Product Line at Tech Expo
BOE’s New OLED Panel: A Detailed Breakdown of Cutting-Edge Display Innovation
iPhone 16 Pro Benchmarks Reveal A18 Pro's Multi-Core Performance Surpasses M1 Chip
AMD Ryzen AI 7 PRO 360: First 8-Core Zen 5 APU, Debuts in Lenovo ThinkPad T14s Gen 6
Intel Core Ultra 7 258V Outperforms AMD Ryzen Z1 Extreme in Ashes of the Singularity Benchmark
Intel's Core Ultra 5 245K: Detailed Breakdown of Performance and Efficiency
Rambus Unveils Industry-First HBM4 Controller IP: 10 Gbps Speeds Powering Next-Gen AI and GPUs
ASUS Launches ProArt PA27JCV 27-inch Monitor: 5K Resolution and USB-C with 96W Power Delivery
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